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MTConnect is an open, royalty-free standard that is intended to foster greater interoperability between devices and software applications. By establishing an open and extensible channel of communication for plug-and-play interconnectivity between devices, equipment and systems, MTConnect allows sources to exchange and understand each other’s data. This common communication is facilitated by XML and HTTP technology to provide real-time data from throughout a factory. This common communication empowers software developers to implement applications aimed at providing more efficient operations, improved production optimization and increased productivity.
The MTConnect Institute is a not-for-profit 501(c)(6) organization established to further the development of the MTConnect standard and publish related materials. The organization includes Board of Trustees, Technical Advisory Group (TAG), Technical Steering Committee, as well as various working groups to further the standard in specific technology areas. Any company or organization can be a member and aid in furthering the development of the MTConnect standard by becoming a member of the TAG. Membership is free, and it requires agreement to the MTConnect Intellectual Property Policy, which can be found in the “Institute” section.
McLean, Va. … The MTConnect Institute, the developer and administrator of MTConnect, announces the release of the MTConnect standard version 1.3.0. The MTConnect standard is an open-source communication standard for interoperability of manufacturing equipment and devices. This version provides significant features, which include inter-device connectivity to enable machine-to-machine communication, additional data items for equipment and devices, as well as improvement to readability of the standard documents. With this release, the MTConnect Institute also launches the MTConnect User Portal, a community site for implementation best practices and shared experiences about implementation of the standard located at www.MTCup.org. Read more...
McLean, Va., (Oct. 22, 2014) – The fourth annual [MC]2 Conference, hosted by the MTConnect Institute, will be held April 28-30, 2015, at the McCormick Place Conference Center in Chicago, Ill. The MTConnect Institute has also issued a call for speakers, which is open until November 24, 2014. Read more...
Recordings of [MC]2 Conference are available and the links to videos, schedule, abstract, and session descriptions can be found at MTConnectConference.com.
McLean, Va. … The third [MC]2 - MTConnect: Connecting Manufacturing Conference organized by the MTConnect Institute ended on a high note April 10 for the 150 attendees who gathered to immerse themselves in learning about advancements in data-driven manufacturing. “At this year’s [MC]2 conference, attendees were eager to discover how to use MTConnect to align themselves with technology initiatives such as Industry 4.0 and the Internet of Things,” said President and Chairman of the MTConnect Institute Board, Courtney Hill. “The MTConnect standard is foundational to a data-driven manufacturing strategy and a key enabler to implementation.” Read more...
Blairsville, Pa. — April 10, 2014. The National Center for Defense Manufacturing and Machining (NCDMM) and the Office of the Secretary of Defense (OSD) Defense-wide Manufacturing Science and Technology (DMS&T), sponsored along with AMT – The Association For Manufacturing Technology and the U.S. Army Benét Labs, proudly announce the three top winners of the MTConnect Challenge 2 as voted by [MC]2 2014 Conference attendees. Read more...
The MTConnect Institute and the OPC Foundation announce the availability of the MTConnect-OPC UA (Unified Architecture) Companion specification release candidate (RC). “The MTConnect-OPC UA companion specification has been developed to ensure a uniform information model that can be utilized via the MTConnect standard and the OPC UA standard,” said Paul Warndorf, Secretary of the MTConnect Institute and Vice President of Manufacturing Technology at AMT–The Association For Manufacturing Technology. Read more...
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